Blog
PCB Solderability Test: Wetting Methods and Failure Checks
Choose PCB solderability tests, compare wetting methods, and separate finish problems from assembly faults with a practical supplier evidence checklist.
Blog
PCB Potting Thermal Stress: Resin Choice and Cure Checks
Compare rigid and flexible epoxy, read CTE and Shore hardness correctly, and use a qualification checklist before approving a PCB potting material.
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PCB Solder Mask Thickness: Measurement and Acceptance Checks
Separate solder mask thickness from clearance, read a real WCSP limit, and use a measurement checklist to agree PCB coating requirements before fabrication.
Blog
PCB Z-Axis CTE: Tg, Expansion and Via Reliability Checks
Read PCB Z-axis CTE correctly, compare Tg and expansion data, and use a practical checklist for laminate selection, via qualification and supplier review.
Blog
Press Fit PCB Holes: Finished Sizes, Plating and Assembly Checks
Specify press-fit PCB holes using connector drawings, finished-hole tolerances and plating checks. Use a release checklist before assembly.
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PCB Mouse Bites: Tab Placement, Edge Finish and Removal Checks
Review PCB mouse bites before ordering: distinguish tabs from hole spacing, protect critical edges, and use a drawing checklist for controlled separation.
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Via Tenting: Mask Coverage, Open Vias and Fabrication Checks
Choose tented or open vias, check front and back solder mask, and distinguish tenting from filled via-in-pad before releasing PCB fabrication files.
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Solder Paste Storage: Shelf Life, Warm-Up and Dry Paste Checks
Separate solder paste shelf life from stencil life, handle warm-up correctly, and diagnose dry paste with a lot log and practical stop-use checklist.
Blog
PCB Peel Strength Test: Method, Units and Report Checks
Understand PCB copper peel strength, calculate N/mm correctly, compare test conditions, and check supplier reports without relying on a universal pass value.
Blog
PCB Microsection Analysis: What to Inspect and Report Limits
Learn what PCB microsection analysis reveals, how to review measurements and sample identity, and why one good cross-section cannot approve an entire lot.