Blog
1206 Resistor Size: Dimensions, Power and Footprint Guide
Check 1206 resistor dimensions, 3216 metric conversion, power and voltage limits, footprint rules, nearby package sizes and replacement caveats.
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Honeywell XNX Universal Transmitter: Specs, Uses and Selection
Review Honeywell XNX specifications, sensor types, outputs, applications, XCD differences, selection steps, and potential replacement considerations.
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Head-in-Pillow Solder Defects
Understand head-in-pillow BGA defects, compare similar faults, and choose inspection evidence, paste checks and controlled trials before rework.
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Solder Balling After Reflow
Diagnose solder balls after reflow. Compare balling, beading and bridging, then check paste deposits, material condition and measured board profiles.
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Reflow Thermocouple Attachment
Attach reflow thermocouples to the right measurement point. Compare solder, tape and adhesive methods, probe specifications and misleading traces.
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Stencil Area Ratio: Formula
Calculate stencil area ratio with formulas and examples. Compare foil thickness and aperture changes, then check a real QFN stencil drawing.
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Conformal Coating Cure Time: Times by Coating Type
Compare conformal coating cure times for acrylic, silicone, polyurethane, epoxy, UV and parylene, with product-specific temperatures and handling limits.
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Conformal Coating Bubbles: Causes, Prevention and Checks
Troubleshoot conformal coating bubbles and pinholes using timing clues, 419D process limits and a reusable trial log before recoating a PCB assembly.
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Conformal Coating Adhesion Failure: Causes and Test Checks
Diagnose peeling conformal coating with failure-location checks, MG 419D parameters and a reusable witness-coupon worksheet before changing your process.
Blog
Epoxy Potting Exotherm: Batch Size, Heat and Cure Checks
Control epoxy potting exotherm with batch-size checks, internal temperature measurements, an MG 832C data example and a reusable cure qualification worksheet.