Blog
Head-in-Pillow Solder Defects
Understand head-in-pillow BGA defects, compare similar faults, and choose inspection evidence, paste checks and controlled trials before rework.
Blog
Solder Balling After Reflow
Diagnose solder balls after reflow. Compare balling, beading and bridging, then check paste deposits, material condition and measured board profiles.
Blog
Reflow Thermocouple Attachment
Attach reflow thermocouples to the right measurement point. Compare solder, tape and adhesive methods, probe specifications and misleading traces.
Blog
PCB Reflow Process: Profile Control, Defects and Inspection Checks
Understand the complete PCB reflow process from solder paste and placement through measured thermal profiling, oven zones, defect analysis, inspection and release.
Blog
PCB Soldering Process: Preparation, Heat Control and Inspection Checks
Compare reflow, wave, selective and hand PCB soldering processes, their key controls, common defects and inspection evidence.
Blog
PCB SMT Assembly Process: Printing, Placement and Inspection Checks
Follow PCB SMT assembly from file and material control through paste printing, SPI, placement, reflow, AOI, X-ray and electrical test.